GSAT]
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[¹ÝµµÃ¼]
1. Wafer Á¦Á¶
2. Oxidation »êÈ)
3. Photolithography (Æ÷Åä°øÁ¤)
4. Etching (½Ä°¢)
5. Thin Film Deposition (¹Ú¸· ÁõÂø) & Ion implantation (ÀÌ¿Â ÁÖÀÔ)
6. Metallization (±Ý¼Ó¹è¼±)
7. EDS (°Ë»ç) : Yield (¼öÀ²)
8. Packaging
+a : CMP (Chemical Mechanical Polishing)
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¡Ø ÇØ´ç Èıâ´Â ÇØÄ¿½ºÀâ GSAT+¹ÝµµÃ¼ ºý¼¾½ºÅ͵𸦠ÅëÇØ ¼öÁýµÈ ÈıâÀÔ´Ï´Ù.