* ÇØÄ¿½ºÀ⠹ݵµÃ¼ Àΰ üÇè´Ü¿¡ ¼±Á¤µÇ¾î °ÀǸ¦ Á¦°ø ¹Þ°í ³²±â´Â ÈıâÀÔ´Ï´Ù. *
1ÁÖÂ÷, 2ÁÖÂ÷ °ÀǸ¦ ¼ö°ÇÏ¿´À¸¸ç,
1ÁÖÂ÷¿¡´Â ¹ÝµµÃ¼ ÀÔ¹® °ÀÇ, 2ÁÖÂ÷¿¡´Â ¼ÒÀÚ/°øÁ¤/¸éÁ¢´ëºñ °ÀǸ¦ ÇнÀÇÏ¿´½À´Ï´Ù.
1ÁÖÂ÷ °ÀÇ¿¡¼´Â ÀÔ¹®°ÀÇ·Î ¹è°æÁö½Ä, Á¤ÀÇ, »ê¾÷±âÃÊ, °øÁ¤±âÃʵîÀ» ÇнÀÇÏ¿´½À´Ï´Ù.
±âº»ÀûÀÎ Á¤ÀÇ¿¡ ´ëÇؼ ÇнÀÇÏ¿´°í, ¹ÝµµÃ¼ »ê¾÷ °ü·Ã ±â¾÷¿¡ ´ëÇØ ¾Ë ¼ö ÀÖ¾ú½À´Ï´Ù.
°¢ ±â¾÷ÀÇ ÁÖ »ê¾÷ÀÌ ¹«¾ùÀÎÁö ¾Ë ¼ö ÀÖ¾ú°í, ÀÚÄ© °øÁ¤ ÇнÀ¿¡ Ä¡ÁßµÇ¾î °£°úÇÒ ¼ö ÀÖ´Â ºÎºÐµéÀ» »ó±â½Ãų ¼ö ÀÖ¾ú½À´Ï´Ù.
±×¸®°í °³·«ÀûÀÎ ¹ÝµµÃ¼ Á¦Á¶ °øÁ¤¿¡ ´ëÇØ ÇнÀÇÏ¿´½À´Ï´Ù.
Wafer Á¦Á¶, Oxidation, Photo, Etching, CMP, Thin Film depo, Ion implantation, Metallization, EDS, Packing, CMP µî Á¦Á¶ Process¿¡ ´ëÇØ °£·«ÇÏ°Ô ¾Ë ¼ö ÀÖ¾ú½À´Ï´Ù.
2ÁÖÂ÷ °ÀÇ¿¡¼´Â Energy level, Fermi level, ¼ÒÀÚ(p-n junction, MOSFET, MOSCAP), 8´ë °øÁ¤¿¡ ´ëÇØ ÇнÀÇÏ¿´½À´Ï´Ù.
¹ÝµµÃ¼ °³³äÀÇ ±âº»ÀÌÁö¸¸ ÀÌÇØÇϱ⠾î·Á¿ü´ø Energy level, Fermi level¿¡ ´ëÇØ ±ò²ûÇÏ°Ô Á¤¸®ÇÒ ¼ö ÀÖ¾ú½À´Ï´Ù. ¶ÇÇÑ ¼ÒÀÚ Çü¼º ¿ø¸®´Â Ç×»ó Çò°¥¸®°í Á¤È®ÇÏ°Ô ÀÌÇØÇÏÁö ¸øÇÏ¿´¾ú´Âµ¥, À߸øµÈ Á¤ÀǵéÀ» ¤¾îÁÖ¾î ±²ÀåÈ÷ µµ¿òÀÌ µÇ¾ú½À´Ï´Ù.
8´ë °øÁ¤ °ÀÇ¿¡¼´Â °¢ Process¿¡¼ÀÇ mechanicalÇÑ Á¤¸®¿¡ µµ¿òÀÌ µÇ¾ú½À´Ï´Ù. Àú´Â ÈÇÐ Àü°øÀ̱⠶§¹®¿¡ °¢ °øÁ¤¿¡ ´ëÇÑ ¹ÝÀÀÀ» ÁÖ·Î ¹è¿ü´Âµ¥, Àåºñ¾È¿¡¼ wafer°¡ ¾î¶»°Ô ÁøÇàµÇ´ÂÁö ÀÌÇØÇÒ ¼ö ÀÖ¾î À¯ÀÍÇÏ¿´½À´Ï´Ù.
¸éÁ¢°ÀÇ´Â ¹ÝµµÃ¼ °øÁ¤¿¡ ´ëÇØ ÀÌ¹Ì ÇнÀÇÑ ÇлýÀ» ´ë»óÀ¸·Î ÇÏ´Â °Á¿´½À´Ï´Ù.
Energy level, Fermi level, p-n junction µî µî ÁÖÁ¦¸¦ ¼±Á¤ÇÏ¿© ±âÃâ ¹®Á¦¸¦ ¿¹½Ã·Î, ¾î¶² ½ÄÀ¸·Î ´äº¯À» ÇؾßÇÏ´ÂÁö ¹è¿ï ¼ö ÀÖ¾ú½À´Ï´Ù.
¸¶Áö¸·À¸·Î, °¢ °ÀǸ¶´Ù ¸éÁ¢ ±âÃâÀ» ¼Ò°³ÇØÁÖ¸ç key words¸¦ Á¦½ÃÇØÁÖ´Â °ÍÀÌ µµ¿òÀÌ µÇ¾ú½À´Ï´Ù. Çٽɳ»¿ëÀÌ ¾î¶² °ÍÀÎÁö, ¾î¶² ³»¿ë À§ÁÖ·Î °øºÎÇÏ¸é µÇ´ÂÁö ¾Ë ¼ö ÀÖ¾î µµ¿òÀÌ µÇ¾ú½À´Ï´Ù.