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ÇØÄ¿½ºÀ⠱赿¹Î ¼±»ý´Ô 8´ë °øÁ¤ °³¿ä ¹× Oxidation & CMP °­ÀÇ ¼ö°­ÇÏ¿´½À´Ï´Ù!

¿À´Ãµµ ¿ª½Ã³ª ¼¼¼¼ÇÏ°Ô ¼³¸í Àß ÇØÁּ̽À´Ï´Ù!

¹ÝµµÃ¼¿¡¼­´Â Á¦ÀÏ ÇÙ½ÉÀÌ 8´ë°øÁ¤ÀÌÁÒ!

±â°è°øÇÐ Àü°øÇÏ´Ùº¸´Ï 8´ë°øÁ¤Á¶Â÷µµ ¸ô¶ú¾ú´Âµ¥ ¼±»ý´Ô ´öºÐ¿¡ ¾Ë¾Ò½À´Ï´Ù!

À̹ø °­ÀÇ¿¡¼­´Â Oxidation°ú CMPºÎºÐ¿¡ ´ëÇؼ­¸¸ ¼³¸íÇØÁÖ¼ÌÁö¸¸, ´Ù¸¥ °­ÀÇ¿¡¼­´Â 8´ë°øÁ¤ °¢°¢ÀÇ ³»¿ë¿¡ ´ëÇؼ­ ¾Ë·ÁÁֽŴÙÇÏ´Ï ±â´ë°¡ µË´Ï´Ù!

À̹ø¿¡µµ °­ÀÇ ³»¿ëÀº ¿Ã¸± ¼ö°¡ ¾ø¾î¼­ ª°Ô³ª¸¶ Áß¿ä³»¿ë Á¤¸®Çص帳´Ï´Ù!

ÇØÄ¿½ºÀâ [±âº»] 15°­ [°øÁ¤] 8´ë °øÁ¤ °³¿ä ¹× Oxidation & CMP

1. ¹ÝµµÃ¼ 8´ë°øÁ¤

- Wafer Á¦Á¶ + Àü°øÁ¤(Oxidation, Photolithography, Etching, Thin Film Deposition & Ion Implantation, Metalization) + ÈÄ°øÁ¤(EDS (test), Package)

2. Oxidation

- Si -> SiO2 »êÈ­¸·À» Çü¼ºÇÏ´Â °øÁ¤

- º¸Åë Thermal Oxidation °øÁ¤À» °¡Àå ¸¹ÀÌ »ç¿ë

- Thermal OxidationÀº Dry Oxidation°ú Wet Oxidation µÎ Á¾·ù°¡ ÀÖÀ½

- Dry OxidationÀº ¹°¾øÀÌ »ê¼Ò¸¦ ÅëÇؼ­ Si¿Í ¹ÝÀÀ

-> ¹ÝÀÀ ¼Óµµ°¡ ´À¸®´Ùº¸´Ï »êÈ­¸·ÀÇ ÁúÀÌ ÁÁ´Ù

- Wet OxidationÀº »ê¼Ò¸¦ ÅëÇؼ­ Si¿Í ¹ÝÀÀ

-> ¹ÝÀÀ ¼Óµµ´Â ºü¸£³ª ±×·Î ÀÎÇØ »êÈ­¸·ÀÇ ÁúÀÌ ÁÁÁö ¾ÊÀ½

3. Oxide Ư¼º ¹× ¿ªÇÒ

- Si¿Í ´Ù¸¥ etching Ư¼ºÀ» °¡Áø´Ù.

- Si¿Í ´Ù¸¥ Diffusion ¼Óµµ¸¦ °¡Á®, Si°¡ ³ëÃâµÈ ºÎºÐ¸¸ DopingÀÌ °¡´É

- ºÎµµÃ¼À̸ç, Si¿ÍÀÇ surface Ư¼ºÀÌ ÁÁ´Ù.

- Oxidation ÁøÇà °£ Si°¡ ¼Ò¸ðµÇ°í ºÎÇÇ°¡ ÆØâÇÑ´Ù.

4. OxideÀÇ ¼ºÀå

- 900~1200µµ Á¤µµÀÇ °í¿Â¿¡¼­ Thermal oxidation °øÁ¤ ÁøÇà

- ¼ºÀå¼Óµµ

-> ¹ÝÀÀ Ãʱ⿡´Â Si¿Í Oxidant(O2 or H2O)ÀÇ È­ÇйÝÀÀ ¼Óµµ¿¡ ÀÇÇØ °áÁ¤µÇÁö¸¸,

Oxide ¼ºÀå ÈÄ¿¡´Â SiO2¸¦ Åë°úÇÏ´Â ¼Óµµ¿¡ ÀÇÇØ °áÁ¤µÈ´Ù.

5. CMP (Chemical Mechanical Polishing)

- wafer Ç¥¸éÀÇ »êÈ­¸·, ±Ý¼Ó¸· µîÀÇ ¹Ú¸·À» ÆòźȭÇÏ´Â °øÁ¤

- ¹ÝµµÃ¼ÀÇ °íÁýÀûÈ­·Î ÀÎÇØ waferÀÇ Æòźµµ°¡ Áß¿äÇØÁü¿¡ µû¶ó CMPµµ Áß¿äÇØÁü

- CMP ¹æ¹ý : ȸÀüÇÏ´Â PadÀ§¿¡ wafer¸¦ ¿Ã¸®°í, slurry¸¦ ¶³¾î¶ß·Á È­ÇÐÀû ¿¬¸¶¸¦ ½ÃŲ´Ù. Pad´Â Ç¥¸é ¿¬¸¶¸¦ À§ÇÑ ´Ü´ÜÇÑ ºÎºÐ°ú wafer¿ÍÀÇ ¹ÐÂøÀ» ÀÌÇÑ ºÎµå·¯¿î ºÎºÐÀÇ ÀûÃþ ±¸Á¶·Î µÇ¾î ÀÖÀ¸¸ç Pad¿¡ ÀÇÇØ ±â°èÀûÀ¸·Î ¿¬¸¶°¡ µÈ´Ù. ¶ÇÇÑ wafer carrier´Â wafer°¡ pad¿¡ Àß ´êÀ» ¼ö ÀÖµµ·Ï ¾Ð·ÂÀ» °¡ÇØÁÖ´Â ¿ªÇÒÀ» Çϸç, pad conditioner¸¦ ÅëÇØ padÀÇ Ç¥¸éÀ» Á¤¸®ÇØÁָ鼭 CMP°øÁ¤À» ÇÏ°Ô µÈ´Ù.

- Hard polishing : ±â°èÀû ¼³ºñ (º£¾î¸µ)¿¡ ÀÇÇØ wafer ¾Ð·Â Á¶Àý

- Soft polishing : wafer¿Í wafer carrier »çÀÌ¿¡ Air-bagÀÌ Á¸Àç

6. CMP °øÁ¤ Ư¼º

- Removal rate : ´ÜÀ§ ½Ã°£´ç Á¦°ÅµÇ´Â ºñÀ²

- Uniformity : ±ÕÀϵµ

- Selectivity : ¿¬¸¶ ¼±Åúñ

7. CMP ¹ß»ý°¡´É issue

- Scratch : ÀÔÀÚ, ¾Ð·Â, Æе忡 ÀÇÇÑ

- Selectivity Â÷ÀÌ¿¡ µû¸¥ erosion

- Dishing effect

¿À´Ãµµ ¾î±è¾øÀÌ ±èµ¿¹Î¼±»ý´ÔÀÇ Self assessment ÀÔ´Ï´Ù!

1. ¹ÝµµÃ¼ 8´ë °øÁ¤ Àü¹Ý¿¡ ´ëÇØ ¼³¸íÇϽÿÀ.

2. MOSFET¿¡¼­ Oxide¿Í Semiconductor Á¢ÇÕ¸éÀÇ Æ¯¼ºÀ» °³¼±½ÃÅ°±â À§ÇÑ Oxidation ¹æ¹ýÀº ¹«¾ùÀ̸ç, ±× ¿ø¸®¿¡ ´ëÇØ ¼³¸íÇϽÿÀ.

3. CMP °øÁ¤¿¡ ´ëÇØ ¼³¸íÇϽÿÀ.



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